Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
New York: Wiley-Interscience, 1994. Second Printing. Hardcover. Octavo; xxxi, 426 pages. More
Carpe Diem Fine Books
New York: Wiley-Interscience, 1994. Second Printing. Hardcover. Octavo; xxxi, 426 pages. More